| Product code | CB-00007235 |
|---|
Flux-gel RELIFE RL-559-IM (100 gr)
Highly active viscous solder paste without lead and halogens. Suitable for soldering printed circuit boards of mobile phones, processors and other electronic components. Recommended for use with leaded and lead-free solders.
Features:
~ imported ecological rosin from Japan;
~ high viscosity and strong activity;
~ effective removal of oxides;
~ protects metals from corrosion;
~ suitable for BGA soldering;
~ easy application;
~ fast tinning, without residue.
You can order flux through the website or contact the manager by phone indicated on the website.
| Product code | CB-00007235 |
|---|---|
| Compatible models | Characteristic:Melting point: 138 °CViscosity: 250-350 Pa·sActivity: RMAColor: transparent with a yellowish tintContent: 100 g |
UA
RO
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