QianLi Magnetic BGA Reball Platform for iPhone 13 / 13 Pro / 13 Pro Max / 13 Mini (4 in 1)

QianLi Magnetic BGA Reball Platform for iPhone 13 / 13 Pro / 13 Pro Max / 13 Mini (4 in 1)

iPhone 13 / 13 Pro / 13 Pro Max / 13 Mini motherboard soldering repair platform.

Features:
~ intelligent auxiliary alignment line;
~ a special groove for cutting the motherboard;
~ magnets effectively reduce the gap between the stencil and the motherboard;
~ silicone anti-slip pads for effective temperature insulation, prevention of slipping and burns;
~ exact positioning of the motherboard.

Using:
Step 1: Install the motherboard.
Step 2: Install the appropriate stencil.
Step 3. Apply solder paste.
Step 4: Uniform heating.

You can order a platform for reballing with stencils through the website or contact the manager by phone indicated on the website.