Mechanici 008 Compound Removal Blade Set

The Mechanic 008 Compound Removal Blade Set is designed for professional electronics repair. It is used to carefully remove compound, glue and residual protective materials from BGA chips, microcircuits and motherboards of smartphones, tablets and laptops. Suitable for manual polishing and fine service work without damaging components.

Features:
1. Ultra-thin design: The blade thickness of only 0.11 mm ensures precise and delicate work in hard-to-reach places.
2. Hand polishing: The blades are carefully polished by hand, which guarantees high sharpness, smooth cutting edges and long service life.
3 Premium material: Made of imported 304 stainless steel, which combines strength, flexibility and wear resistance.
4. Laser processing: High-precision laser cutting ensures a clean cut without burrs and minimal material loss.
5. Flexibility and strength: the blade retains its sharpness even when bent, does not break during operation.
6. Versatility: the set includes blades of various sizes and shapes, which allows you to choose the optimal tool for a specific type of repair work.

Characteristics:
Model: Mechanic 008
Material: 304 stainless steel
Blade thickness: 0.11 mm
Blade size: 46.5 × 5.8 × 0.4 mm
Weight: 26 g
Package size: 158 × 199 × 5 mm

You can order a set of blades for removing compound through the website or contact the manager by phone number indicated on the website.