Soldering paste Mechanic XGSP50 183°C (42gr)

Soldering paste Mechanic XGSP50 183°C (42gr)

Solder paste is a consumable for soldering, includes flux, as well as solder microparticles, the size of which is 25-45 microns.

Characteristics:
Composition: Sn-63%, Pb-37%;
Melting point: 183 °C;
Solder particle size: 24-45 microns
Packaging: 42 grams

Solder paste has the following advantages:
- high quality of soldering;
- resistance to spreading when heated;
- a small residual amount of flux after soldering;
- the possibility of using automated installation.

It is a rather viscous substance that should be mixed before use. When working, the surface of the printed circuit board must be cleaned and degreased, the board should be placed horizontally. Solder paste should preferably be applied with a spatula. The required amount is determined from the area of ​​the surfaces to be soldered.

When heated, the paste decreases in size after the flux boils. After that, the balls of solder that are part of the paste begin to melt.

The advantage of soldering paste is that it can be used for soldering without a soldering iron and even without a hair dryer. To do this, you need to apply the paste, for example, to the "twisting" of the wires, heat the connection with a gas burner or lighter, and the solder contained in the paste will firmly connect the wires.

You can order solder paste through the website or contact the manager by phone indicated on the website.