QianLi DP-008 Glue Removal Scalpel/Knife (Carbon Handle)

QianLi DP-008 Glue Removal Scalpel/Knife (Carbon Handle) is designed for high-precision and delicate cleaning of motherboards from glue residues, compound, as well as for disconnecting components during the repair of mobile phones, tablets and other high-precision electronics. It allows you to effectively remove hardened glue without damaging sensitive tracks and elements on the board. Especially effective for work that requires a more pronounced bend or "hook" of the blade, which allows you to lever components or work at an angle.

Features:
1. Lightweight and durable carbon handle: ensures the tool's lightness and durability, as well as an ergonomic design for comfortable work.
2. Tip with a pronounced bend at the end: designed for levering components, working at an angle or for more aggressive removal of glue that has seeped into difficult places.
3. Hand-polished blade: Each blade undergoes a hand-polished process to ensure controlled sharpness. This allows for effective removal of adhesive without damaging the surface of the motherboard or chip.
4. High-quality blade steel: Made of imported steel with a thickness of 0.4-0.12 mm, which makes it strong, wear-resistant and deformation-resistant, ensuring a long service life.
5. Safe rounded blade edge: Reduces the risk of accidental damage to sensitive components and tracks on the motherboard.
6. Compact: Small and convenient size provides excellent maneuverability and a wider view of the work area during delicate repairs.
7. Robust construction: Ensures the stability and durability of the tool.

Specifications:
Model: DP-008
Handle material: Carbon fiber
Blade material: Imported steel
Blade thickness: 0.4-0.12 mm

You can order a scalpel / knife for removing glue through the website or contact the manager by phone number listed on the website.