| Product code | CB-00016249 |
|---|
Stencil BGA QianLi QS13 for Qualcomm Snapdragon 845 SDM845 / 865 / 865+ / 870 SM8250 / 710 SDM710
A stencil is a metal plate with holes cut out that is used to apply solder paste to a BGA-type chip board.
The BGA stencil ensures precise and uniform application of solder paste to the board, which avoids problems such as insufficient contact between the chip and the board or signal degradation. Stencils are usually made of stainless steel or nickel-plated steel, and have precisely cut holes that match the location of the solder paste balls on the chip.
Bga stencils are selected individually for each chip. Also, the stencils differ in diameter and the number of so-called "balls", which are used in the restoration of microcircuits.
You can order a stencil through the website or contact the manager by phone indicated on the website.
| Product code | CB-00016249 |
|---|---|
| Compatible models | Qualcomm Snapdragon 845 SDM845; Qualcomm Snapdragon 865 SM8250; Qualcomm Snapdragon 865+ SM8250; Qualcomm Snapdragon 870 SM8250; Qualcomm Snapdragon 710 SDM710; Qualcomm Snapdragon Wear 3100 MSM8909W. |
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