| Product code | CB-00016250 |
|---|
Stencil BGA QianLi QS14 for Qualcomm Snapdragon 765 SM7250 / 730-730G-732G SM7150 / 675 SM6150
A stencil is a metal plate with holes cut out that is used to apply solder paste to a BGA-type chip board.
The BGA stencil ensures precise and uniform application of solder paste to the board, which avoids problems such as insufficient contact between the chip and the board or signal degradation. Stencils are usually made of stainless steel or nickel-plated steel, and have precisely cut holes that match the location of the solder paste balls on the chip.
Bga stencils are selected individually for each chip. Also, the stencils differ in diameter and the number of so-called "balls", which are used in the restoration of microcircuits.
You can order a stencil through the website or contact the manager by phone indicated on the website.
| Product code | CB-00016250 |
|---|---|
| Compatible models | Qualcomm Snapdragon 765 SM7250; Qualcomm Snapdragon 730 SM7150; Qualcomm Snapdragon 730G SM7150; Qualcomm Snapdragon 732G SM7150; Qualcomm Snapdragon 675 SM6150; Qualcomm Snapdragon 855 SM8150; Qualcomm Snapdragon 660 SDM660; Qualcomm Snapdragon 439 SDM439; Qualcomm Snapdragon 665 SM6125; Qualcomm Snapdragon 210 MSM8909. |
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