| Product code | CB-00016252 |
|---|
Stencil BGA QianLi QS22 for Samsung Exynos 5 Octa 5430 / Exynos 8 Octa 8890 / Exynos 8 Octa 8895
A stencil is a metal plate with holes cut out that is used to apply solder paste to a BGA-type chip board.
The BGA stencil ensures precise and uniform application of solder paste to the board, which avoids problems such as insufficient contact between the chip and the board or signal degradation. Stencils are usually made of stainless steel or nickel-plated steel, and have precisely cut holes that match the location of the solder paste balls on the chip.
Bga stencils are selected individually for each chip. Also, the stencils differ in diameter and the number of so-called "balls", which are used in the restoration of microcircuits.
You can order a stencil through the website or contact the manager by phone indicated on the website.
| Product code | CB-00016252 |
|---|---|
| Compatible models | Samsung Exynos 5 Octa 5430 - Samsung Galaxy Alpha SM-G850; Meizu MX4 Pro; Samsung Galaxy A7 SM-A700. Samsung Exynos 8 Octa 8890 - Samsung Galaxy S7 SM-G930; Samsung Galaxy S7 Edge SM-G935; Samsung Galaxy Note 7 SM-N930; Meizu Pro 6 Plus. Samsung Exynos 8 Octa 8895 - Samsung Galaxy S8 SM-G950; Samsung Galaxy S8 Plus SM-G955; Samsung Galaxy Note 8 SM-N950; Meizu 15 Plus. |
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